C. William Hall - Undergraduate Travel Scholarship

About this program

Society for Biomaterials (SFB) offers the C. William Hall Undergraduate Travel Scholarship to cover all expenses for attendance at the 2027 SFB Annual Meeting & Exposition in Seattle (April 27–May 1, 2027), including airfare, hotel, transfers, registration, and meals. The award honors the Society’s first president and targets junior or senior undergraduates pursuing a bachelor’s in bioengineering or a related discipline with a focus on biomaterials. Applicants must submit an application form plus supplemental documents — university transcripts, a letter of support from an advisor/mentor, a brief project statement, and a brief career goals statement — by September 18, 2026.